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Wireless Federation » archive for 'MID'

Intel to support development of China’s mobile TV standard CMMB (Taiwan)

  • July 29th, 2008
  • 12:31 pm

According to sources in the Taiwan handset industry, Intel will support the development of China’s mobile TV standard China mobile multimedia broadcasting (CMMB) by supporting mobile Internet device (MID) and ultra mobile PC (UMPC) platform products supporting CMMB technology.

In line with Intel’s move, a number of IT makers, including Asustek Computer, Lenovo, Haier, Samsung Electronics and Fujitsu, are reportedly planning to launch CMMB-compatible MID or UMPC products, the sources indicated.

The upcoming CMMB-compatible MID/UMPC devices will feature a display ranging from 6- to 10-inch sizes and run on either Windows Mobile or Linux operating systems, the sources noted.

The development of CMMB MID and UMPC products follows the steps that have taken by Dopod, Samsung and Motorola in the development of CMMB-compatible handsets, pointed out the sources.

   

Option to Develop World’s Smallest Wireless Module Optimized for Intel-Based Mobile Internet Devices (MID)

  • July 13th, 2007
  • 1:20 pm

Option N.V., the wireless technology company, today announced a collaboration with Intel Corporation to optimize WWAN modules for Mobile Internet Devices (MIDs) based on Intel’s low power technologies.

Mobile Internet Devices (MIDs) are a new category of truly mobile consumer devices that deliver full Internet experience on the go. These MIDs rely on ubiquitous wireless connectivity and anytime internet access to deliver range of usages around communication, entertainment and information.

Option will deliver WWAN modules that meet the power, size and performance characteristics needed for Mobile Internet Devices in 2008. Two modules are currently in development and will be optimized for MIDs based on Intel low power processors and chipsets. The GTM 201 EDGE module, which will be attractive to major growth markets such as China, Latin America and Southern Africa, and the HSPA module, GTM501 are planned for the first half of 2008. Delivered in an LGA package measuring just 25 x 30 x 2.5 mm, the devices are respectively the world’s smallest EDGE and HSPA WWAN modules.

Jan Callewaert, CEO Option, commented: “Delivering wireless modules that meet the requirements of Mobile Internet Devices is a major challenge and requires specific components and packaging techniques that are only now becoming available. We look forward to collaborating with Intel to optimize the WWAN module for Intel-based Mobile Internet Devices and helping identify customers that will be key to bringing these connected ultra mobile devices to life.”

“Mobile Internet Devices (MIDs) present an exciting growth opportunity for the industry. Intel is innovating for this category by delivering a range of building blocks, including low power processors and chipsets, to our customers” said Anand Chandrasekher, Intel Corporation Senior Vice President and General Manager of the Ultra Mobility Group. “We expect MIDs to have a range of wireless technologies and collaborating with Option on WWAN solutions for the category will help fuel the demand.”