www.WirelessFederation.com/news: NTT DOCOMO, INC. and Telefonica announced today that a Windows Mobile(R) handset model made by Toshiba Corporation will be introduced by both companies in their respective Japanese and Spanish markets in June to July as part of a plan for various joint undertakings by the two mobile operators.

The companies selected the full touch-panel model as an ideal offering for users seeking a versatile, stylish handset. DOCOMO will sell the handset in Japan as the docomo PRO series(TM) T-01A (officially announced on May 19) and Telefonica will sell it in Spain as the TG01.

DOCOMO and Telefonica to Introduce Windows Mobile Handset by Toshiba
DOCOMO and Telefonica are now considering various other initiatives to mutually strengthen corporate competitiveness and customer satisfaction in their respective markets, including a joint study of possible services and applications for open OS handsets.

DOCOMO Senior Vice President and Product Department Managing Director Kiyohito Nagata said: “DOCOMO looks forward to working with global operators such as Telefonica to jointly develop mobile services and applications for mutually enhanced global competitiveness. At the same time, we would be pleased if such efforts have the added effect of supporting Japanese mobile phone manufacturers in their attempts to expand handset sales overseas.”

“Operating system platforms are becoming more and more important to drive the extraordinary growth of mobile internet business. DOCOMO and Telefonica are leading operators in their respective markets and this is a great opportunity to provide their customers with best-in-class products and solutions,” said Luis Ezcurra, Manager of Handsets and Multimedia of Telefonica Espana.

* docomo PRO series, i-mode and FOMA are trademarks or registered trademarks of NTT DOCOMO, Inc. in Japan and other countries.
* NTT DOCOMO’s FOMA service is only available to subscribers in Japan.
* Windows Mobile is a registered trademark of Microsoft Corporation in the united States and other countries.

About NTT DoCoMo

NTT DoCoMo is the world’s leading mobile communications company. DoCoMo serves more than 51 million customers, of which more than half subscribe to FOMA(TM), launched as the world’s first 3G mobile service based on W-CDMA in 2001. DoCoMo also offers a wide variety of leading-edge mobile multimedia services, including i-mode(TM), the world’s most popular mobile e-mail/ Internet service, used by more than 46 million users. With the addition of credit-card and other e-wallet functions, DoCoMo mobile phones have become highly versatile tools for daily life. NTT DoCoMo is listed on the Tokyo (9437), London (NDCM) and New York (DCM) stock exchanges.

For more information, please visit www.nttdocomo.com .

About Telefonica S.A.

Telefonica is one of the most important telecommunication companies in the world as for market capitalization. Its activities are basically centered in landline and mobile operations, as well as broadband services as the key for the development of both endeavors. Telefonica has offices in 25 countries and a customer base of more than 261 million accesses in the world. Telefonica is a strong player in Spain, Europe and Latin America, where it is concentrating its development efforts. Telefonica is a completely privately owned company with more than 1.5 million shareholders. Its capital its currently divided in 4,704,996,485 shares in the most important Spanish stock markets (Madrid, Barcelona, Bilbao and Valencia), as well as the stock exchanges in London, Tokyo, New York, Lima, Buenos Aires and Sao Paulo.

For more information, please visit www.telefonica.com

Toshiba Corporation announced the development of a new USIM card for use in mobile phones supporting the NFC (Near Field Communication) function, in anticipation of the worldwide rollout of mobile contactless services forecast for 2010 and 2011. Toshiba plans to release samples of the new card in the third quarter of 2009, and will exhibit the card and provide full details at the GSMA Mobile World Congress 2009, to be held in Barcelona, Spain, from February 16 through 19.

Toshiba’s newly developed USIM card meets the latest specifications of the European Telecommunications Standards Institute-Smart Card Platform (ETSI SCP) and the GSM Association (GSMA). It is also compatible with the GSMA’s Pay-Buy-Mobile programme, and offers full support for mobile contactless services, and meets all the security levels required for international payment applications.

Toshiba is able to draw on capabilities in mobile phone handsets, semiconductors and systems to deliver a lineup of newly developed USIM cards offering high value-added solutions.

Toshiharu Watanabe, Toshiba Corporate Senior Vice President and President and CEO of the Social Infrastructure Systems Company, said: “The introduction of a USIM card is a significant development for Toshiba, and with our company’s advanced mobile technology and USIM, we would like to provide new solutions to the customer. We are also excited to support the advance of the Pay-Buy-Mobile programme promoted by GSMA, based on our technological achievements in the financial Smart Card sector.”

Moving forward, Toshiba plans to complete final development of the new card by 3Q 2009, when it expects to begin provision of samples to Mobile Network Operators worldwide. With the introduction of the USIM card to the mobile market, Toshiba looks to support mobile phone users with enhanced convenience and full security, and to facilitate the successful development of NFC worldwide.

About Toshiba

Toshiba is a world leader and innovator in pioneering high technology, a diversified manufacturer and marketer of advanced electronic and electrical products spanning information & communications equipment and systems; digital consumer products; electronic devices and components; power systems, including nuclear energy; industrial and social infrastructure systems; and home appliances.

The Smart Card Systems Sales & Marketing Department, is part of the Security & Automation Systems Division in Toshiba’s Social Infrastructure Systems Company. The department has operated for over 20 years and, in addition to development of the USIM card, its achievements include Japan’s first Smart Card. Solutions provided by the department include high-security credit cards; the CAS card, which controls network scrambling of broadcast transmissions; and ID cards used in insurance cards and drivers licenses. Toshiba continues to work on behalf of its customers through overseas subsidiaries and business partners around the world.

For more information, please visit  http://www.toshiba.co.jp/index.htm

Toshiba to shut down MobaHo! (Japan)

A feeble consumer interest has led to close down Toshiba’s  Mobile Broadcasting Corporation subsidiary in March 2009. This service was launched in Japan 2004 and attracted around 100,000 subscribers in four years’ time. Originally, Toshiba forecasts total in excess of a million subcriber by 2007. MobaHo! presently offers eight video channels as well as 40 audio channels. However, the service required users to acquire either a dedicated device or a PC card, no doubt hampering adoption.

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It’s time to add the phrase “Real men have fabs” to the list of laughably-outdated clich¨¦s, along with classics like “If man was meant to fly, he’d have wings,” and “The world needs only five computers.”

That’s because Qualcomm Inc., a company that doesn’t own a single semiconductor production factory, ascended to the Top-10 ranks of the global chip industry in the second quarter, according to iSuppli Corp., marking the first time a fabless company has achieved such a distinction.

Qualcomm, a U.S.-based fabless semiconductor supplier, rose to the ninth position among global semiconductor suppliers in the second quarter, up from 13th in the first quarter. The seller of communications chips in the second quarter achieved revenue $1.4 billion, up 8.6 percent from $1.3 billion in the first quarter.

On its way from 14th to ninth place, Qualcomm surpassed companies with considerable manufacturing assets, including Infineon Technologies AG, Qimonda AG, Freescale Semiconductor and NEC Electronics Corp. Qualcomm now stands shoulder-to-shoulder with chip manufacturing powerhouses including NXP Semiconductors and Hynix Semiconductor Inc.

Qualcomm’s coups
Recent headlines covering Qualcomm’s legal troubles notwithstanding, the company achieved stellar results in the second quarter. The company’s 8.6 percent increase represented the highest growth rate of any Top-10 semiconductor supplier in the second quarter¡ªand marked a significant accomplishment amid a decline in overall chip revenue. Global semiconductor revenue declined by 3.6 percent to $63.1 billion in the second quarter, down from $65.4 billion in the first quarter. The company in the first quarter replaced Texas Instruments Inc. as the world’s top supplier of semiconductors for wireless applications. This marks the first time that Texas Instruments has not occupied the leadership position in this area at least since iSuppli began tracking such market share in 2004.

With its valuable intellectual property, Qualcomm is capitalizing effectively on the transition to 3G technology in the mobile handset market.

iSuppli doesn’t expect the International Trade Commission’s (ITC’s) decision to ban U.S. imports of some mobile phones that include certain Qualcomm chips to significantly damage the company’s third-quarter results.

Asian flu
While Qualcomm surged in the second quarter, Asian semiconductor suppliers Samsung Electronics Co. Ltd, Toshiba Corp., Hynix Semiconductor Inc., Sony Corp. and NEC Corp. all experienced declines in their semiconductor revenue, with Hynix and Toshiba taking the biggest hits among the Top-10 suppliers.

Major weakness in the DRAM sector impacted results at several companies
Hynix of South Korea suffered the steepest sales plunge among the world’s Top-10 semiconductor suppliers, with its revenue dropping to $1.96 billion, down 22.7 percent from $2.5 billion in the first quarter. The company’s woes were entirely due to its falling revenue from sales of its primary product: DRAM. Hynix’s DRAM revenue dropped 29.7 percent in the second quarter compared to the first.

Japan’s Toshiba was the second-biggest decliner among the Top-10, with its semiconductor revenue falling to $2.5 billion, down 19.3 percent from $3.1 billion in the first quarter. The company’s sales drop was broad-based, with revenue decreasing in every semiconductor segment the company competes in, except NAND flash memory.

Faring even worse than Hynix and Toshiba was Sony of Japan, which dropped out of the Top-10 rankings in the second quarter as its semiconductor revenue fell by the highest percentage among the world’s Top-20 suppliers.

Sony’s semiconductor revenue in the second quarter declined to $1.3 billion, down 33.7 percent from $2 billion in the first quarter. The company’s global chip ranking fell to 13th, down from seventh in the first quarter.

Sony suffered huge percentage revenue declines in all semiconductor segments in which it participates. The company’s woes can be traced to a specific applications market: its core consumer electronics business. Company consumer-electronics revenue fell by a stunning $589 million in the second quarter compared to the first, a 33.4 percent decline.

Samsung of South Korea fared better than most of the other Asian and Japanese semiconductor suppliers in the second quarter, with its revenue declining to $4.7 billion, down 2.5 percent from $4.8 billion in the first quarter. With this marginal decline, Samsung actually
outperformed the overall semiconductor market.

Like some of its fellow Asian semiconductor suppliers, Samsung took a major hit in DRAM revenue, with its sales falling to $2.1 billion in the second quarter, down 16.7 percent from $2.5 billion in the first quarter. This decline was offset by a surge in NAND flash memory revenue, which rose to $1.4 billion, up 18.9 percent from $1.2 billion in the first quarter.

Japan’s NEC fell out of the Top-10 rankings on a 2.5 percent decline in revenue to $1.3 billion, down from $1.4 billion in the first quarter.

NEC’s rank declined to 11th, down from 10th in the first quarter. The main culprit for NEC’s decline was display drivers, which suffered a $24 million sales decline compared to the first quarter.

   
 

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It’s time to add the phrase “Real men have fabs” to the list of laughably-outdated clich¨¦s, along with classics like “If man was meant to fly, he’d have wings,” and “The world needs only five computers.”

That’s because Qualcomm Inc., a company that doesn’t own a single semiconductor production factory, ascended to the Top-10 ranks of the global chip industry in the second quarter, according to iSuppli Corp., marking the first time a fabless company has achieved such a distinction.

Qualcomm, a U.S.-based fabless semiconductor supplier, rose to the ninth position among global semiconductor suppliers in the second quarter, up from 13th in the first quarter. The seller of communications chips in the second quarter achieved revenue $1.4 billion, up 8.6 percent from $1.3 billion in the first quarter.

On its way from 14th to ninth place, Qualcomm surpassed companies with considerable manufacturing assets, including Infineon Technologies AG, Qimonda AG, Freescale Semiconductor and NEC Electronics Corp. Qualcomm now stands shoulder-to-shoulder with chip manufacturing powerhouses including NXP Semiconductors and Hynix Semiconductor Inc.

Qualcomm’s coups
Recent headlines covering Qualcomm’s legal troubles notwithstanding, the company achieved stellar results in the second quarter. The company’s 8.6 percent increase represented the highest growth rate of any Top-10 semiconductor supplier in the second quarter¡ªand marked a significant accomplishment amid a decline in overall chip revenue. Global semiconductor revenue declined by 3.6 percent to $63.1 billion in the second quarter, down from $65.4 billion in the first quarter. The company in the first quarter replaced Texas Instruments Inc. as the world’s top supplier of semiconductors for wireless applications. This marks the first time that Texas Instruments has not occupied the leadership position in this area at least since iSuppli began tracking such market share in 2004.

With its valuable intellectual property, Qualcomm is capitalizing effectively on the transition to 3G technology in the mobile handset market.

iSuppli doesn’t expect the International Trade Commission’s (ITC’s) decision to ban U.S. imports of some mobile phones that include certain Qualcomm chips to significantly damage the company’s third-quarter results.

Asian flu
While Qualcomm surged in the second quarter, Asian semiconductor suppliers Samsung Electronics Co. Ltd, Toshiba Corp., Hynix Semiconductor Inc., Sony Corp. and NEC Corp. all experienced declines in their semiconductor revenue, with Hynix and Toshiba taking the biggest hits among the Top-10 suppliers.

Major weakness in the DRAM sector impacted results at several companies
Hynix of South Korea suffered the steepest sales plunge among the world’s Top-10 semiconductor suppliers, with its revenue dropping to $1.96 billion, down 22.7 percent from $2.5 billion in the first quarter. The company’s woes were entirely due to its falling revenue from sales of its primary product: DRAM. Hynix’s DRAM revenue dropped 29.7 percent in the second quarter compared to the first.

Japan’s Toshiba was the second-biggest decliner among the Top-10, with its semiconductor revenue falling to $2.5 billion, down 19.3 percent from $3.1 billion in the first quarter. The company’s sales drop was broad-based, with revenue decreasing in every semiconductor segment the company competes in, except NAND flash memory.

Faring even worse than Hynix and Toshiba was Sony of Japan, which dropped out of the Top-10 rankings in the second quarter as its semiconductor revenue fell by the highest percentage among the world’s Top-20 suppliers.

Sony’s semiconductor revenue in the second quarter declined to $1.3 billion, down 33.7 percent from $2 billion in the first quarter. The company’s global chip ranking fell to 13th, down from seventh in the first quarter.

Sony suffered huge percentage revenue declines in all semiconductor segments in which it participates. The company’s woes can be traced to a specific applications market: its core consumer electronics business. Company consumer-electronics revenue fell by a stunning $589 million in the second quarter compared to the first, a 33.4 percent decline.

Samsung of South Korea fared better than most of the other Asian and Japanese semiconductor suppliers in the second quarter, with its revenue declining to $4.7 billion, down 2.5 percent from $4.8 billion in the first quarter. With this marginal decline, Samsung actually
outperformed the overall semiconductor market.

Like some of its fellow Asian semiconductor suppliers, Samsung took a major hit in DRAM revenue, with its sales falling to $2.1 billion in the second quarter, down 16.7 percent from $2.5 billion in the first quarter. This decline was offset by a surge in NAND flash memory revenue, which rose to $1.4 billion, up 18.9 percent from $1.2 billion in the first quarter.

Japan’s NEC fell out of the Top-10 rankings on a 2.5 percent decline in revenue to $1.3 billion, down from $1.4 billion in the first quarter.

NEC’s rank declined to 11th, down from 10th in the first quarter. The main culprit for NEC’s decline was display drivers, which suffered a $24 million sales decline compared to the first quarter.

   
 

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Not to be outdone by Korean rival Samsung’s advancements in chip architecture and NAND flash memory milestones, Toshiba has announced a breakthrough in embedded NAND Flash chip architecture that will soon lead to smaller and more efficient mobile phones. Toshiba has dubbed the new architecture mobileLBA-NAND – which incorporates both Single Level Cell (SLC) and Multi Level Cell (MLC) flash memory types into the same chip. The higher-speed SLC memory type is ideal for storing programs, while the high-capacity MLC memory type is best suited for storing data.

By combining the two specialized memory formats onto a single chip, handset designers are no longer limited to using the more expensive SLC flash memory format. The new chip architecture will also shave precious bulk by obviating the need for separate SLC and MLC memory banks – giving us smaller and more efficient mobile phones in the near future.

   

 

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